 
HNDT is a laser sensing
technique for
observing, with great detail, the changes in the surface of a part as
it deforms under stress. The stress can arise from the gentle
application of heat, pressure, mechanical stress, or vibration. HNDT
produces a precision surface contour image (much like a topographical
map) where minute deformations (on the order of 0.05 to 0.005 microns)
can be visualized. Highly detailed structural information becomes
visible without damage to the part under inspection. Such information
can also be used to identify structural flaws such as internal voids or
de-laminations. Performance
The
inherently wide field of view and high image resolution provided by HNDT allow the quick and accurate inspection of large areas, saving
inspection time and reducing the risk of overlooking defects. The high
sensitivity of HNDT can reveal subsurface defects in an opaque test
object that might otherwise be overlooked by x-ray or ultrasonic
analysis. HNDT is also a powerful tool for measuring the mechanical and
thermal response of a component to its design environment, providing a
simple, inexpensive way to validate a design or model.
HNDT can
reveal surface movements and contour changes as small as a few micro
inches and these can be seen with the naked eye. With image processing
techniques this high sensitivity can be extended beyond to a few
hundredths of a micro inch (10-8 inches)
MetroLaser
can perform component analysis and evaluation testing in our own
laboratories, or can deliver a custom system for your needs. Contact us for
details and a price quote for your application. Our laboratory is
operated under the supervision of Dr. James D. Trolinger, who brings
over 30 years of experience in this field.
Applications
- Examination of stress
concentration when bolting two or more parts together (i.e., cylinder
heads and engine casings)
- Leak testing of sealed
devices (i.e., hermetically sealed batteries)
- Identification of
disbonding or delamination flaws (i.e., laminated honeycomb panels,
tires, multi-layer printed circuit boards, composites, painted
surfaces, etc.)
- Detection of thermal
deformation in a precision casting (i.e., computer disk drives)
- The location of solder
joint failures (i.e., electronic components on a PC board)
- Non-contact
vibrational analysis (i.e., automotive disk brakes and jet engine
turbine wheels)
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